-Represents ACM’s First Delivery to Singapore-based Facility-

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, announced the recent delivery of several 300mm single-wafer cleaning systems to a foundry customer’s front-end wafer fabrication facility in Singapore. This marks ACM’s first deployment to a Singapore-based fab and an important step in expanding ACM’s presence in Southeast Asia as part of its global growth strategy.

The systems support wafer backside cleaning and wet etch processes for advanced semiconductor manufacturing. Its core process technologies have undergone international process validation and are designed to meet the stringent performance, yield, and reliability requirements of leading semiconductor manufacturers.

“This first deployment in Singapore demonstrates our commitment and capability to support advanced semiconductor manufacturing at leading global fabs,” said David Wang, ACM’s President and Chief Executive Officer. “As customers continue to expand capacity across regions, we remain focused on delivering differentiated process technologies that meet the performance and reliability standards required by today’s advanced manufacturing processes.”

Singapore is a key global semiconductor manufacturing hub supporting advanced production for customers across Asia and beyond. This delivery reflects ACM’s continued commitment to serving strategically important fabrication sites worldwide and highlights growing international customer confidence in ACM’s innovative technologies and product quality.

Forward-Looking Statements

Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.

About ACM Research, Inc.

ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.

© ACM Research, Inc. The ACM Research logo is a trademark of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.