CORRECTING and REPLACING CAPTION UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony

New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs

Please replace the photo caption with the following corrected caption: (From Left to Right) Michael Hsu, UMC Vice President; Jermaine Loy, EDB Managing Director; Dr Beh Swan Gin, MTI Permanent Secretary;  Teo Chee Hean, Senior Minister; Gan Kim Yong, Deputy Prime Minister; SC Chien, UMC President; Christine Wong, JTC Assistant Chief Executive Officer; Yao Chu Shiang, L&K Chairman.

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(From Left to Right) Michael Hsu, UMC Vice President; Jermaine Loy, EDB Managing Director; Dr Beh Swan Gin, MTI Permanent Secretary;  Teo Chee Hean, Senior Minister; Gan Kim Yong, Deputy Prime Minister; SC Chien, UMC President; Christine Wong, JTC Assistant Chief Executive Officer; Yao Chu Shiang, L&K Chairman

The updated release reads: 

UMC UNVEILS NEW FAB EXPANSION IN SINGAPORE IN GRAND OPENING CEREMONY

New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually. It will also be one of the most advanced semiconductor foundries in Singapore, manufacturing semiconductors to enable communications, Internet of Things (IoT), automotive, and AI innovations.

The ceremony was attended by Deputy Prime Minister and Minister for Trade and Industry of Singapore Gan Kim Yong, Senior Minister and Coordinating Minister for National Security of Singapore Teo Chee Hean, Permanent Secretary of Singapore’s Ministry of Trade and Industry Beh Swan Gin, Managing Director of the Singapore Economic Development Board (EDB) Jermaine Loy, and JTC Assistant Chief Executive Officer Christine Wong.

The facility, a greenfield expansion adjacent to UMC’s existing fab in the Pasir Ris Wafer Fab Park, spans two phases. Up to US$5 billion will be invested to bring the first phase to full capacity of 30,000 wafers per month, with room for further investment in a second phase expansion in the future. The new facility is equipped for manufacturing with UMC’s industry-leading 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore’s semiconductor sector – for global customers’ products including premium smartphone display chips, power-efficient memory chips for IoT devices, and next-generation connectivity chips. The expansion is expected to create approximately 700 jobs locally over the next few years, including process and equipment engineers as well as research and development engineers.

“This new state-of-the-art facility in Singapore signals a new phase of growth for UMC. It enhances our ability to meet future chip demand, driven by continuous innovations in connectivity, automotive, and AI,” said SC Chien, President of UMC. “The unique geography of Singapore also makes the new facility well placed to support our customers in strengthening supply chain resilience. This fab expansion closely aligns with the Singapore government’s vision to become a leading advanced manufacturing hub, and we are deeply grateful for their support.”

“We welcome UMC’s expansion in Singapore. This new fab introduces new leading edge specialty semiconductor capabilities and production capacity that will enhance Singapore’s competitiveness as a critical node in the global semiconductor supply chain. This significant investment underscores our long-standing partnership with UMC, and we look forward to deepening our collaboration to strengthen Singapore’s semiconductor ecosystem,” said Jermaine Loy, Managing Director of the Singapore Economic Development Board.

The new facility was built according to rigorous sustainability standards, and has obtained the Green Mark GoldPlus certification from Singapore’s Building and Construction Authority. A standard part of all UMC’s new fab designs to align with UMC’s goal to be 100% powered by renewable energy by 2050, the new facility will be installed with 17,949 square meters of solar panels on its rooftop. In addition to the manufacturing site, the expansion also includes a brand-new office building, a full-sized multipurpose sports hall, and other amenities for employees and community members to enjoy.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

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The new facility is equipped for manufacturing 22nm and 28nm solutions for global customers’ products including premium smartphone display chips, power-efficient memory chips for IoT devices, and next-generation connectivity chips.