United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the release of its 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, with the process design kit now available for customer designs. Successfully validated at UMC’s Fab 12A, the new process boosts power efficiency and performance while reducing chip size, supporting the evolution of next-generation display technologies.

Compared to UMC’s 22nm process - currently the most advanced display driver IC solution in production - the 14nm eHV FinFET platform achieves up to 40% reduction in power consumption and 35% reduction in chip area, enabling longer battery life and thinner driver modules for premium smartphone models. With FinFET devices replacing planar transistors in the digital circuitry, the 14nm platform further enhances electrical performance through optimized I/O devices and higher drive speeds, ensuring robust signal integrity while supporting higher refresh rates for high-resolution display applications. In addition, the optimized mid-voltage device capabilities, featuring tighter layout pitch and a broader voltage range, provide greater flexibility for optimizing source driver circuit design.

“Displays are pervasive and requirements will continue to evolve to deliver better visual quality at faster speeds and lower power consumption. UMC is proud to be a leader in the display driver IC market, and this new 14nm eHV platform marks a major step forward as we bring FinFET technology to display drivers for the first time,” said Steven Hsu, Vice President of Technology Development at UMC. “As our customers’ products continue to advance forward with new capabilities and features, UMC is committed to providing them with the foundry technologies to turn their innovations into manufacturable reality.”

UMC has been the undisputed foundry leader in the OLED display driver IC market, and is currently the only foundry offering the most advanced 22nm display driver IC solution. With leading eHV technology, comprehensive IP resources, and strong design support, UMC offers the industry’s most comprehensive high-voltage process solutions, spanning from 0.6µm to 14nm nodes.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

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The 14nm eHV FinFET platform achieves up to 40% reduction in power consumption and 35% reduction in chip area, enabling longer battery life and thinner driver modules for premium smartphone models.